Digital Microcircuit Testing
Component Packaging
Taping and Reeling
Prom Programming
Processing
Environmental Conditioning
Solderability / Tinning
PLD Programming
Final Inspection
Hardware / Assembly and Fabrication
Reliability Testing
R/F Microwave
Discrete Testing
Materials Analysis
Relays & Cables
RF Microwave
Environmental Testing
Prom Programming

 

Component Packaging

NJMET /Metropolitan Labs is proud to present a Contract Assembling and Packaging Service in order to accommodate the demanding request of custom packaging, diminishing source manufacturing or obsolete production of components requiring the demand of re-manufacturing.

  Component Assembly / Packaging

C-DIP
P-DIP
FLAT PACK
PLCC
LCC
PGA
QFP
SOIC
CQFP
METAL CAN (VARIOUS)
BGA
PQA
HYBRID
FR MODULE
TSOP
SIP
J LEAD
GULL WIN
Component Packaging

Wafer / Die Acquisition and Preparation

Component Packaging
NJMET/Metropolitan Labs can provide acquisition of any wafer – die in conjunction with precision cutting in preparation for assembly or shipment to your valued customer.

Pre – Cap Visual Inspection

NJMET/Metropolitan Labs can provide Die visual inspection to commercial, MIL-STD-750 & 883 (class B or class S) levels

 

Electrical Testing

NJMET/Metropolitan Labs can provide post assembly electrical testing in order to meet commercial, military, industrial and automotive performance requirements accommodating SSI-VHLSI component technology.

 

Component Screening and Qualifications

NJMET/Metropolitan Labs can provide post assembly component screening and qualification to meet MIL-STD-750 & 883 (class B or class S) levels in conjunction with custom aerospace design requirements.

 

Marking

NJMET/Metropolitan Labs can provide custom marking to commercial or MIL-STD-130 levels in conjunction with providing resistance to solvents (permanency) evaluation for marking quality and durability.